Thirteen Industry Leaders Unite to Define Active Copper Cable Standards

Thirteen leading companies in the networking, semiconductor, and cabling sectors announced the formation of the Active Copper Cable Multi-Source Agreement (ACC-MSA) in Santa Clara, California, on February 23, 2026. The consortium, co-chaired by MACOM and Semtech, aims to establish specifications for active copper cables (ACC) that enhance performance while minimizing power usage, cost, and latency—key concerns in today's high-performance computing landscape.

Founding members include prominent industry players such as AMD, Cisco, and NVIDIA. The group's initial focus is on creating optimized copper interconnections that leverage integrated linear equalizers, allowing for significantly extended connectivity ranges and reduced cable thickness compared to traditional methods. Marek Tlaka from MACOM emphasized the importance of extending copper cabling reach to support the growing demands of artificial intelligence (AI) and other high-performance applications.

The ACC-MSA's specifications will cover electrical, firmware, and testing requirements, ensuring seamless interoperability across different vendors. Scott Schube from Semtech highlighted the consortium's commitment to fostering innovation and collaboration across the industry, thus accelerating the adoption of next-generation copper connectivity solutions.

Market insights suggest that AI hardware infrastructure expenditures are projected to surpass $1 trillion by 2029, with networking infrastructure nearing $200 billion in the same period. Alan Weckel of 650 Group asserted that ACCs are crucial for these developments, facilitating low-power, cost-effective short-reach interconnects.

The ACC-MSA seeks to minimize the barriers to industry-wide adoption by creating a multi-source ecosystem that brings together various players to elevate the standards of copper connectivity in a rapidly evolving technological landscape. For more information, visit their official site at acc-msa.org.

The formation of the Active Copper Cable Multi-Source Agreement (ACC-MSA) marks a significant development within the networking, semiconductor, and cabling industries. Comprised of thirteen influential leaders including MACOM and Semtech, this consortium is primed to redefine the standards for active copper cables. With the increasing demands for efficient, cost-effective, and high-performance interconnect solutions, this initiative is of paramount importance for investors and industry stakeholders alike.

The ACC-MSA aims to tackle the fundamental challenges tethered to power consumption, latency, and interoperability within high-speed copper cabling. By focusing on optimized copper interconnects that integrate linear equalizers, companies can expect advancements that reduce cable thickness while simultaneously enhancing performance metrics. This innovation aligns with the rapid growth of AI infrastructure, with estimates suggesting hardware spending could surpass $1 trillion by 2029, driving demand for efficient networking infrastructure projected to reach $200 billion.

Investors should keep an eye on companies that are part of this consortium, as collaboration among industry leaders typically leads to accelerated innovation and improved market positions. The focus on next-generation copper connectivity indicates potential growth opportunities for companies involved in developing these standards, particularly those that stand to gain from increased market adoption of ACC solutions.

Furthermore, as the ACC-MSA addresses critical factors like interconnect economics and performance enhancements, companies that successfully adapt to these changes may enjoy competitive advantages and improved profitability. Overall, the emergence of the ACC-MSA serves as a pivotal moment, and stakeholders should consider strategies that capitalize on the evolving landscape of high-performance interconnect solutions. Investing in this arena could yield significant returns as the demand for robust networking infrastructure continues to rise.