ROHM's New Compact, Highly Reliable Package Added to Automotive 40V/60V MOSFET Lineup

ROHM Semiconductor has unveiled its latest offerings in low-voltage MOSFETs (40V/60V) for automotive applications with the introduction of the new HPLF5060 package, measuring 4.9mm × 6.0mm. This expansion is critical for contemporary automotive technologies, including main inverter control circuits, electric pumps, and LED headlights, where there is a growing demand for smaller component sizes.

The trend towards miniaturization in automotive electronics often brings challenges, particularly concerning reliable mounting due to narrow terminal spacing and leadless designs. The HPLF5060 addresses these hurdles by offering a compact footprint compared to the traditional TO-252 package (6.6mm × 10.0mm) while improving board-mount reliability via gull-wing leads. The incorporation of copper clip junction technology further enhances the package’s capability for high-current operations, making it well-suited for the rigorous demands of automotive environments.

Mass production for these MOSFETs using the HPLF5060 package began in November 2025, and they are now available for purchase online through distributors like DigiKey and Farnell. ROHM is also planning to introduce a smaller DFN3333 package (3.3mm × 3.3mm), featuring wettable flank technology, in February 2026, along with a new TOLG package (9.9mm x 11.7mm) designed for high power and high reliability.

These advancements come under ROHM’s EcoMOS™ brand, recognized for its energy-efficient silicon power MOSFETs applicable in home appliances, industrial equipment, and automotive systems. This diverse product lineup allows for tailored solutions based on key performance parameters, ensuring the needs of various applications are met effectively.

ROHM Semiconductor's recent expansion of its automotive low-voltage MOSFET lineup, particularly the introduction of the HPLF5060 package, presents a compelling investment opportunity. As the automotive industry increasingly pivots towards electric vehicles (EVs) and smart technologies, the demand for high-performance and reliable semiconductor components is skyrocketing. The new HPLF5060, with its compact dimensions and improved reliability, is well-timed to cater to this growing need.

The market for automotive electronics, especially in areas such as main inverter control circuits, electric pumps, and LED headlights, is expected to witness substantial growth. This is driven by the automotive industry's shift towards electrification and automation to meet regulatory requirements and consumer preferences for eco-friendly vehicles. ROHM’s adoption of gull-wing leads in the HPLF5060 package not only enhances mounting reliability but also positions it as a go-to option for manufacturers dealing with space constraints in modern vehicle designs.

Moreover, innovative manufacturing technologies such as copper clip junctions bolster the HPLF5060's appeal, enabling high-current operations crucial in demanding automotive environments. This positions ROHM strategically within the competitive landscape, as companies are constantly seeking ways to improve efficiency and reduce size without compromising performance.

The recent launch of products featuring this advanced packaging signifies ROHM’s focus on staying ahead in the semiconductor race. Investors should pay close attention to this segment, as the mass production of smaller and more reliable components will likely enhance ROHM’s market share and profitability in the automotive sector.

As ROHM further develops its product lineup, including the upcoming DFN3333 and TOLG packages, long-term investors could benefit from the company's robust growth trajectory in the semiconductor market, driven by ongoing innovations and increased demand for automotive electronics.