Semtech Demonstrates AI Data Center Connectivity Expertise at DesignCon 2026
MWN-AI** Summary
Semtech Corporation, a prominent player in high-performance semiconductors and IoT solutions, highlighted its expertise in AI data center connectivity at DesignCon 2026, held from February 24-26 at the Santa Clara Convention Center. The company focused on addressing critical power efficiency and bandwidth challenges amidst the rising demand from hyperscale AI infrastructure, as noted by Dell’Oro Group, which reported significant bandwidth growth in data center interconnects, primarily driven by cloud providers.
As AI data centers expand to maximize efficiency across multiple electric grids, Semtech positioned itself as a trusted advisor for infrastructure architects transitioning to advanced interconnects at 400G, 800G, and 1.6T speeds. Amit Thakar, Vice President of Signal Integrity Product Marketing at Semtech, expressed the challenges customers face regarding scaling GPU clusters while maintaining power constraints and signal integrity, underscoring the importance of the technical discussions held at DesignCon.
Semtech conducted two notable technical presentations during the conference. The first, “400G Channels for AI Applications: Passive & Active Copper Cable Assemblies to Enable Scale Up/Scale Out,” evaluated copper solutions for high-density GPU clusters. The second presentation focused on “200G Per Lane Linear Pluggable Optical Channels for Power-Efficient AI Interconnects,” emphasizing the company’s innovative optical interconnect strategies.
In addition to the presentations, Semtech hosted private demonstrations, allowing attendees to experience firsthand the advanced connectivity solutions designed for modern AI data center architectures. With a commitment to providing cutting-edge technology solutions, Semtech continues to empower developers in the infrastructure sector, aligning with the growing demands of AI-enabled computing. For more details about their offerings, interested parties are encouraged to visit Semtech’s website or connect with them on social media platforms.
MWN-AI** Analysis
Semtech Corporation (Nasdaq: SMTC) is making significant strides in the field of artificial intelligence data center connectivity, as evidenced by its showcasing at DesignCon 2026. The company’s robust presence at the event, featuring technical presentations on power-efficient interconnect solutions, indicates strong prospects for its growth, especially amidst the rising demand for bandwidth driven by hyperscale AI infrastructure.
The data center interconnect market is witnessing unprecedented bandwidth growth, largely propelled by cloud providers’ expansions. This trend is underpinned by a strategic shift among hyperscalers towards scaling GPU clusters while optimizing power and signal integrity, critical components highlighted in Semtech's presentations. The projected continuous growth in data center interconnects casts a favorable light on Semtech, suggesting that it is well-positioned to capitalize on this evolving landscape.
Market analysts should consider Semtech as a strong player in the semiconductor domain given its commitment to enabling high-performance solutions essential for future infrastructure needs. The company's focus on 400G, 800G, and 1.6T interconnects aligns perfectly with the industry's shift towards faster data processing capabilities, making its technology offerings highly relevant.
Furthermore, Semtech’s strong relationships with leading technology partners like TE Connectivity fortify its credibility and market position. The hands-on demonstrations offered at DesignCon suggest a proactive approach to client engagement, allowing potential customers to evaluate and appreciate the efficacy of Semtech’s solutions firsthand.
In conclusion, investors and market professionals should keep Semtech on their radar. With its innovative solutions addressing critical industry demands and a clear focus on power-efficient technology, Semtech stands as a compelling investment opportunity in the ever-expanding AI and data center connectivity markets.
**MWN-AI Summary and Analysis is based on asking OpenAI to summarize and analyze this news release.
System architects to present power-efficient interconnect solutions for hyperscale AI infrastructure
Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, will showcase artificial intelligence (AI) data center connectivity expertise at DesignCon 2026 (Feb. 24-26, Santa Clara Convention Center) through technical presentations and private demonstrations addressing critical power efficiency and bandwidth challenges in hyperscale deployments.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260218481565/en/
Semtech Demonstrates AI Data Center Connectivity Expertise at DesignCon 2026
According to Dell’Oro Group, data center interconnect accounted for the most bandwidth growth over the past year, driven by large deployments from cloud providers. This trend is expected to continue beyond 2026 as hyperscalers expand AI data centers across multiple buildings to tap into different electricity grids for power-hungry GPU compute clusters.
As data center interconnect drives unprecedented bandwidth growth, Semtech’s DesignCon presence reinforces its position as a trusted partner for infrastructure architects navigating the transition to 400G, 800G, and 1.6T interconnects.
“Our customers are navigating unprecedented challenges—scaling GPU clusters while managing power constraints and signal integrity at multi-terabit speeds,” said Amit Thakar, vice president of signal integrity product marketing at Semtech. “DesignCon provides the ideal platform to share technical insights on both copper and optical approaches that help infrastructure architects optimize for performance, efficiency, and scalability.”
Semtech Technical Presentations
“400G Channels for AI Applications: Passive & Active Copper Cable Assemblies to Enable Scale Up/Scale Out”
Wednesday, Feb. 25, 11:15 AM PT, Ballroom E
Joint presentation with TE Connectivity examining copper solutions for high-density GPU clusters. Semtech Presenters: Edward Frlan, Senior System Architect; Sameh Elnaggar, Electrical Engineer.
“200G Per Lane Linear Pluggable Optical Channels for Power-Efficient AI Interconnects”
Thursday, Feb. 26, 2:00 PM PT, Ballroom B
Semtech Presenters: Mark Kimber, Sr. Director of Product Definition, and Edward Frlan present Semtech’s approach to power-efficient optical interconnects.
Visit Semtech at DesignCon 2026
Semtech will host private demonstrations throughout the conference in a dedicated meeting room, offering hands-on evaluation of connectivity solutions for AI data center architectures. Schedule a meeting or learn more at www.semtech.com .
About Semtech
Semtech Corporation (Nasdaq: SMTC) is a leading provider of high-performance semiconductor, IoT systems and cloud connectivity service solutions dedicated to delivering high-quality technology solutions that enable a smarter, more connected and sustainable planet. Our global teams are committed to empowering solution architects and application developers to develop breakthrough products for the infrastructure, industrial and consumer markets. To learn more about Semtech technology, visit us at Semtech.com or follow us on LinkedIn or X .
Semtech and the Semtech logo are registered trademarks or service marks of Semtech Corporation or its subsidiaries. All other trademarks, service marks and trade names mentioned in this press release are the property of their respective owners.
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View source version on businesswire.com: https://www.businesswire.com/news/home/20260218481565/en/
Michelle Lozada, [email protected]
FAQ**
How is Semtech Corporation SMTC addressing the challenges of power efficiency for AI data centers through its interconnect solutions presented at DesignCon 2026?
2. What specific advancements in 400G, 800G, and 1.6T interconnect technology will be showcased by Semtech Corporation SMTC at the DesignCon conference?
3. Can you elaborate on the collaboration between Semtech Corporation SMTC and TE Connectivity regarding copper solutions for high-density GPU clusters during the presentations?
4. How does Semtech Corporation SMTC envision the future of AI data center connectivity, particularly with respect to power-driven optical interconnects discussed at DesignCon 2026?
**MWN-AI FAQ is based on asking OpenAI questions about Semtech Corporation (NASDAQ: SMTC).
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